Advanced System Packaging for Embedded High Performance Computing
نویسندگان
چکیده
Recent advances in microelectronic packaging promise unprecedented levels of performance for embedded computing. High performance machines that have been traditionally confined to a computer room environment can now be packaged for airborne, shipborne, or mobile applications. Multichip module (MCM) packaging has emerged as the first step in achieving this level of integration. However, new technologies are also required to provide the systems infrastructure needed to support high power density assemblies in an embedded environment. This paper outlines an approach that leverages recent advances in system packaging to meet modern challenges in high density interconnect, thermal management, and power distribution.
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